Integrated Circuit Technologies Questions and Answers

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Integrated Circuit (IC) Technologies are fundamental to Digital Electronics and modern hardware design. This section includes digital electronics aptitude questions and answers focused on IC fabrication, MOSFETs, CMOS logic, and VLSI design principles. Students preparing for GATE, BHEL, BEL, and other electronics competitive exams can benefit from these IC technology questions with answers, which test both theoretical and application-oriented understanding. Practicing regularly improves your problem-solving accuracy and helps in mastering semiconductor device concepts for engineering placements.

Integrated Circuit Technologies

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11. The active switching element used in all TTL circuits is the ________.

  • bipolar junction transistor (BJT)
  • field-effect transistor (FET)
  • metal-oxide semiconductor field-effect transistor (MOSFET)
  • unijunction transistor (UJ)
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12. An open-collector output requires ________.

  • a pull-down resistor
  • a pull-up resistor
  • no output resistor
  • an output resistor
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13. Most TTL logic used today is some form of ________.

  • Schottky TTL
  • tristate TTL
  • low-power TTL
  • open-collector TTL
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14. One output structure of a TTL gate is often referred to as a ________.

  • totem-pole arrangement
  • diode arrangement
  • JBT arrangement
  • base, emitter, collector arrangement
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15. It is best not to leave unused TTL inputs unconnected (open) because of TTL's ________.

  • noise sensitivity
  • low-current requirement
  • open-collector outputs
  • tristate construction
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16. Which is not an output state for tristate logic?

  • HIGH
  • LOW
  • High-Z
  • Low-Z
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17. TTL is alive and well, particularly in ________.

  • industrial applications
  • educational applications
  • military applications
  • commercial applications
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18. PMOS and NMOS circuits are used largely in ________.

  • MSI functions
  • LSI functions
  • diode functions
  • TTL functions
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19. If ICCH is specified as 1.1 mA when VCC is 5 V and if the gate is in a static (noncharging) HIGH output state, the power dissipation (PD) of the gate is ________.

  • 5.5 mW
  • 5.5 W
  • 5 mW
  • 1.1 mW
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20. Which is not a precaution for handling CMOS?

  • Devices should be placed with pins down on a grounded surface, such as a metal plate.
  • All tools, test equipment, and metal workbenches should be earth grounded.
  • CMOS devices should not be inserted into sockets or PC boards with the power on.
  • Wear wool clothes at all times.
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